The MacBook Pro models M2 Pro and M2 Max have a significantly smaller heatsink due to supply chain issues, teardowns show.
The changed thermal architecture of the new MacBook Pro appears to be due to the smaller footprint of the M2 Pro and M2 Max SoCs in the device, as iFixit and Max Tech report. The M1 Pro and M1 Max MacBook Pro contain two large memory modules while the M2 Pro and M2 Max MacBook Pro house four smaller memory modules. Although the M2 Pro and M2 Max chips are physically larger than the M1 Pro and M1 Max chips, the SoCs require less space overall. This means that the M2 Pro and M2 Max MacBook Pro models do not require as large a heatsink as the previous generation. It is unclear whether this has a significant impact on thermal efficiency. The reason for using four smaller memory modules appears to be a supply chain issue.
MacBook Pro 2023 teardown: M2 Pro & M2 Max offer up to 20 percent more CPU performance
The entire SoC is assembled on one substrate, allowing Apple to use a smaller substrate with four smaller modules, saving material and reducing complexity. Dylan Patel, senior analyst at SemiAnalysis, told iFixit:
ABF substrates were in very short supply when Apple decided to design them. By using four smaller modules instead of two larger ones, they can reduce the routing complexity within the substrate from memory to the SoC, resulting in fewer layers on the substrate. This allows them to further stretch the limited substrate supply.
The M2 Pro and M2 Max offer up to 20 percent more CPU performance and 30 percent more GPU performance than their predecessors. Since the chips are still based on TSMC's 5nm process, some users have noted that Apple may have made thermal compromises to improve performance. (Image: Apple)
