{"id":55365,"date":"2025-06-03T23:54:43","date_gmt":"2025-06-03T21:54:43","guid":{"rendered":"https:\/\/www.apfelpatient.de\/?p=55365"},"modified":"2025-06-03T23:54:45","modified_gmt":"2025-06-03T21:54:45","slug":"iphone-18-apple-plans-radical-chip-update-with-2-nm","status":"publish","type":"post","link":"https:\/\/www.apfelpatient.de\/en\/rumors\/iphone-18-apple-plant-radikales-chip-update-mit-2-nm","title":{"rendered":"iPhone 18: Apple plans radical chip update with 2 nm"},"content":{"rendered":"

Although the iPhone 17 hasn't even been released yet, concrete information about the next generation is already emerging. The iPhone 18\u2014especially the iPhone 18 Pro and iPhone 18 Fold\u2014is expected to feature a completely new chip: the A20. The first details come from well-known analyst Jeff Pu, who described some of the technical innovations in a note to investors. Analyst Ming-Chi Kuo also anticipates similar specifications. This provides a clear early picture of where the next iPhone generation is headed.<\/strong><\/p>\n\n\n\n

If you're interested in Apple's technological developments, the iPhone 18 is a fascinating look. The focus is clearly on the new A20 chip, which is said to be not only more powerful but also fundamentally different from its predecessors. A foldable model \u2013 the iPhone 18 Fold \u2013 is also apparently in the works. The combination of a new manufacturing process, a different design, and potential advantages such as better battery life or more efficient AI performance makes the A20 chip a key component of the 2026 iPhone.<\/p>\n\n\n\n

The A20 chip brings the switch to 2 nm<\/h4>\n\n\n\n

According to Jeff Pu, the A20 chip, which will be used in the iPhone 18 Pro, iPhone 18 Pro Max, and iPhone 18 Fold, will be manufactured using TSMC's 2-nanometer process. Apple currently uses chips with a 3-nm structure width. The A17 Pro (iPhone 15 Pro) is based on TSMC's first 3-nm generation (N3B), the A18 (iPhone 16) on the second generation (N3E), and the upcoming A19 chip (presumably in the iPhone 17) is said to use the third 3-nm process (N3P). The A20 will mark the first switch to the 2-nm process (TSMC N2). According to previous reports, this should result in up to 15% more performance and up to 30% less power consumption. The smaller manufacturing process allows more transistors to be placed on the same chip, which directly impacts speed and efficiency.<\/p>\n\n\n\n

New chip packaging: RAM directly on the wafer<\/h4>\n\n\n\n

Another unique feature of the A20 chip is the planned chip packaging technology. Jeff Pu assumes that Apple will use TSMC's Wafer-Level Multi-Chip Module (WMCM) for the A20. This means that the RAM will not be installed separately and connected to the main chip via a silicon interlayer, as is currently the case. Instead, the RAM will be packaged directly on the same wafer as the CPU, GPU, and Neural Engine. This change could provide several advantages:<\/p>\n\n\n\n